PRODUCT
PRODUCT
Contacts：
Xinxiu Zhu
Tel：
15223848168
Email：
sd02@qunwin.com
QQ：
876843941
Address：
Lidu Park，F(xiàn)uling District，Chongqing，China
PRODUCT
ULA materials
Withthedevelopmentofflipchiptechnology,α-particleinducedsofterrorsaregraduallyincreasing.Underthecurrentpackagingtechnologyandconditions,theuseoflowαsolderisacost-effectivemeasuretoreducet
Low Alpha Solder Ball
Assemiconductorchipsbecomesmallandhighlyintegrated,softerrorsinducedbyαparticlesshouldnotbeignored.Underthecurrentpackagingtechnologyandconditions,usinglowαsolderisaneconomicalandeffective
Liquid metal
Gabasedliquidmetalisprocessedbynon-toxicmetalsGa,In,Sn,Zn,silver,etc.Liquidmetalatroomtemperatureasahighthermalconductivity,deformable,currentandelectromagneticdualcontroloftheflowofmetal,istoreplaces
Micro-coil
Micro-coil
Column With Copper Wrap
Copper coated strip welding post
Ordinary tin pillar
Ordinary tin pillar
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