PRODUCT
PRODUCT
Contacts：
Xinxiu Zhu
Tel：
15223848168
Email：
sd02@qunwin.com
QQ：
876843941
Address：
Lidu Park，F(xiàn)uling District，Chongqing，China
PRODUCT
Copper Cored Solder Ball forms bumps between a substrate and a chip and the core of the bumps keeps fixed height as designed and relieves an external impact as well.Copper Cored Solder Ball is an excellent solution for the 3D stack package, and also has a certain application in the narrow-pitch packaging field.
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15223848168
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